#ndt X-ray inspection systems are key tools for quality control, yield enhancement, and failure analysis of PCBs and semiconductor devices. In many cases, these capable tools provide the only non-destructive techniques for inspection of electronic components. There have been significant improvements in the X-ray inspection capabilities (both 2D and 3D) in the last several years. In this paper we report a new development that permits material and thickness information to be obtained via 2D X-ray inspection.

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Source: NDT