{"id":13484,"date":"2018-11-06T23:19:00","date_gmt":"2018-11-06T23:19:00","guid":{"rendered":"https:\/\/iesinspection.com\/on-semiconductor-introduces-50-megapixel-imaging-chip\/"},"modified":"2018-11-06T23:19:00","modified_gmt":"2018-11-06T23:19:00","slug":"on-semiconductor-introduces-50-megapixel-imaging-chip","status":"publish","type":"post","link":"https:\/\/iesinspection.com\/?p=13484","title":{"rendered":"ON Semiconductor Introduces 50 Megapixel Imaging Chip"},"content":{"rendered":"<p>#ndt ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, is enabling more efficient inspection of smartphone displays with the introduction of a new 50 megapixel (MP) resolution charge-coupled device (CCD) image sensor. As the highest resolution Interline Transfer CCD image sensor commercially available, the KAI-50140 provides the critical imaging detail and high image uniformity needed not only for inspection of smartphone displays but also circuit board and mechanical assembly inspection as we&#013;<br \/>\nSource: NDT<\/p>\n","protected":false},"excerpt":{"rendered":"<p>#ndt ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, is enabling more efficient inspection of smartphone displays with the introduction of a new 50 megapixel (MP) resolution charge-coupled device (CCD) image sensor. As the highest resolution Interline Transfer CCD image sensor commercially available, the KAI-50140 provides the critical imaging detail and high image uniformity needed not [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"false","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":[],"categories":[],"tags":[45],"_links":{"self":[{"href":"https:\/\/iesinspection.com\/index.php?rest_route=\/wp\/v2\/posts\/13484"}],"collection":[{"href":"https:\/\/iesinspection.com\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/iesinspection.com\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/iesinspection.com\/index.php?rest_route=\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/iesinspection.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=13484"}],"version-history":[{"count":0,"href":"https:\/\/iesinspection.com\/index.php?rest_route=\/wp\/v2\/posts\/13484\/revisions"}],"wp:attachment":[{"href":"https:\/\/iesinspection.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=13484"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/iesinspection.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=13484"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/iesinspection.com\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=13484"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}