As core power devices in fields such as new energy vehicles and photovoltaic inverters, IGBT modules contain multiple complex layers (such as chips, solder layers, DBC ceramic substrates, etc.). Any minor packaging defects (such as voids in the solder layer, cracks, delamination, poor soldering, etc.) can lead to inadequate heat dissipation and concentrated thermal stress, ultimately resulting in module failure. For example, delamination defects between the IGBT chip and the heat sink baseplate may create t
Source: NDT
