Chip packaging (IC Packaging) is a crucial step in semiconductor manufacturing. Its purpose is to protect the bare dies (cut from wafers) and provide electrical connections and physical support to external circuits. Packaging not only affects chip performance (such as heat dissipation and signal transmission) but also directly determines its reliability and cost. The water immersion scanning acoustic microscope is an essential tool for inspecting chip packaging. Its detection principle is as follows:
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Source: NDT
